Drive the industrialization
of high-tech lidar sensor
for autonomous driving
at Scantinel (backed by Zeiss and Scania)
You will be optimizing our photonic packaging solution to downsize the lidar sensor system
by over 90% and increase its reliability to fulfill automotive standards.
Hybrid working possibilites
We are a fast growing startup in the sector of photonics, optics and automotive.
Our vision is to build the best-in-class lidar sensor for autonomous driving.
The target of your team
In this video, group leader Frank Gindele will give you an overview about his background and the focus areas of the Optics & Mechanics Team.
You will be working in a team of seven experts in the field of mechanics, optics and photonics coming from four different nations.
here.Not the place for a video? Then check out the video content
We are devoted in the development of next-generation solid-state LiDAR sensors, focusing on utilizing our patented FMCW LiDAR technology to provide new dimensions of data information.
Long detection range of up to 300m with 1550nm wavelength
Unique velocity measurement setting the benchmark in fast object identification
High robustness in tough environmental conditions
Range and velocity measurement at our testing ground
The FMCW - currently measuring
Want to learn more about our product?
Click here for our technology white paper.
"To ensure that our technology can reach its potential the packaging must ensure a precision of some micrometers and stability in a tough environment."
Our main challenges you will be working on
"Now we are talking about a device which is the size of a home printer.
But ideally, in two years, it's going to be as big as an camera system now.
Therefore we need to achieve new levels of integration and technology developments."
"Currently we are in the proof of concept phase in which about 10 modules are enough. But already within 1 year we want to scale up to a batch size of about 100 pieces and within the next 3-4 years we want to reach serial production."
Tasks as a Photonic Packaging Expert
Create the photonic packaging concept for advanced integrated optical sensors
Develop a gluing and assembly process for high precision optical components
Create chip and module packaging specifications and drive their implementation in close cooperation with international technology partners
Testing and qualifying the packaged components
Support the selection of partners and sub-contractors for chip and module packaging
Your ideal profile
Master or PhD in engineering, fundamental or material science
What you should bring with you ...
Expert knowledge in photonic packaging processes as well as industry insights into photonic packaging houses
Willingness to work in a fast moving environment with high levels of ambiguitiy and rapidly changing markets
Hands on attitude
Experience with low to high volume production ramp-up
Skills in Matlab, Labview C++ or Python
Experience in cooperation with external partners
... and this would be nice to have
3 years of experience in photonic packaging, photonic integration and integrated optics
or high precision optical assembling
Knowledge about material science, assembling and gluing technology
Sounds just like you?
What makes working at Scantinel special?
In this short video, Frank and Alfredo will tell how the Scantinel's diversity and task variety create an exciting work environment.